Recently, the Shenzhen Municipal Bureau of Industry and Information Technology issued the “Shenzhen Action Plan for Accelerating the High-Quality Development of the AI Server Industrial Chain (2026–2028)” (hereinafter referred to as the “Action Plan”), which covers multiple sectors including AI servers, AI chips, optical modules, and storage chips.

The Action Plan points out that by 2028, the production capacity and shipments of AI server products in the whole industry chain will grow by leaps and bounds, and the global market share of products in key areas such as core chips, storage, printed circuit boards (PCB), power storage, optical modules and passive components will increase significantly. Core chips and key products have achieved technological breakthroughs, and gradually cultivated a number of "specialized, special and new" and "single champion" enterprises with excellent technology and significant market advantages, the formation of large and medium-sized enterprises coordinated development of the industry echelon.

The Action Plan points out that it supports domestic GPU, NPU, CPU, DPU and other core chip products to accelerate application and iteration and form a complete industrial ecology. Encourage the research and development and industrialization of high-performance computing chips based on RISC-V architecture, develop high-speed Ethernet switching chips, PCIe/CXL switching chips, etc., and promote technology iteration and performance upgrades. Support the development and application of third-generation semiconductor power devices, support the development of scenario-specific power solutions, and forward-looking layout of next-generation power semiconductor technologies.

The Action Plan proposes to promote the intergenerational upgrade of optical modules from 800G to 1.6T/3.2T and support the landing of mass production projects of 800G and above optical modules. Focus on the development of high-speed, low-power silicon optical modules, CPO/LPO/NPO packaged optical modules, and promote the breakthrough and large-scale application of core technologies such as high-end thin film lithium niobate and high-end indium phosphide. Promote the evolution and industrial application of all-optical switching technology, and all-optical chips and optical devices.

The Action Plan proposes to support the research and development and application of memory chips, speed up the research on advanced packaging technology of memory chips, and focus on the development of high-end storage products such as enterprise SSD and enterprise memory modules. Strengthen the research and development of new technologies such as near-storage packaging and integration of storage and calculation, enhance the supply capacity of high-end storage, and build a high-end storage product supply system suitable for large model training and supercomputing centers.