Our optical module product series has the advantages of low power consumption and good compatibility, which can meet the connection between data center servers, switches, routers and other storage and computing instruments, and provide cost-effective solutions for data center connection.

Focusing on miniaturization and low power consumption, we provide customized semiconductor materials, micro optoelectronic device chips and mini optical module solutions. With high-purity substrates and micro-laser chips as the core, it adapts to the high-speed short-range communication needs of smart terminals and portable devices to help consumer electronics lightweight and high-speed upgrade.

To create an integrated solution for vehicle-grade semiconductor materials and optoelectronic devices to adapt to the harsh working environment of the vehicle. Wide temperature range, anti-interference core chip and substrate, with the car-level optical module, to achieve high-speed and stable interaction between on-board equipment and the vehicle communication network, in line with the car-level reliability and safety standards.

Customize the integration of semiconductor core materials to high-speed optical transmission devices to match low latency and high bandwidth requirements. High-response laser chip and special substrate for the core support of vision equipment, with low-delay optical module, to achieve industrial scene image data loss-free real-time transmission, enabling intelligent manufacturing high-precision applications.

The introduction of high stability, high security semiconductor materials and optoelectronic device solutions. High-purity low-loss semiconductor materials provide the core foundation for medical equipment, customized chips and optical modules to adapt to the data interaction needs of imaging, remote consultation and other equipment, anti-interference characteristics to ensure the accuracy and safety of medical data transmission.

To create a cost-effective semiconductor core chip to optical transmission device overall solution, adapt to the global, high-definition security needs. High compatibility chip and substrate support high-definition monitoring equipment, with long-distance, low-power optical module, to achieve stable transmission of audio and video data in security networking, adapt to the outdoor complex environment.

Relying on silicon optical integration and the whole industry chain technology advantages, to provide 5G communication core device solutions. High-speed laser chip, customized semiconductor substrate, with miniaturized high-speed optical module, to achieve 5G base station, core network of large-capacity low-latency transmission, to help 5G network wide coverage, deep deployment.